PC/ABS SABIC C2950
PC/ABS SABIC C2950
PC/ABS SABIC C2950 is a well‑balanced halogen‑free flame‑retardant alloy material with good flowability, heat resistance and high‑impact resistance.
Main Applications
Electrical‑Electronic: charger housings, computer enclosures, communication equipment, home‑appliance products, lighting devices.
Automotive Industry: automotive interior and exterior parts.
Others: business machines, medical‑device components, electrical‑electronic applications.
Physical Properties
| Property Category | Test Item | Test Standard | Data | Unit |
|---|---|---|---|---|
| Physical Properties | Density / Specific Gravity | ASTM D792 | 1.18 | g/cm³ |
| Melt Flow Rate (MFR) | 260°C/2.16 kg, ASTM D1238 | 10 | g/10 min | |
| Mold Shrinkage (3.20 mm) | Internal Method | 0.40‑0.60 | % | |
| Water Absorption (24hr) | ASTM D570 | 0.10 | % | |
| Mechanical Properties | Tensile Strength (Yield) | ASTM D638 | 62.7 | MPa |
| Elongation at Break | ASTM D638 | 40 | % | |
| Flexural Strength (Yield) | ASTM D790 | 102 | MPa | |
| Flexural Modulus | ASTM D790 | 2650 | MPa | |
| Izod Notched Impact Strength (23°C) | ASTM D256 | 530 | J/m | |
| Izod Notched Impact Strength (-30°C) | ASTM D256 | 160 | J/m | |
| Rockwell Hardness (R‑Scale) | ASTM D785 | 123 | — | |
| Thermal Properties | Heat‑Distortion Temperature (1.8 MPa, unannealed, 3.20 mm) | ASTM D648 | 90.6 | °C |
| Heat‑Distortion Temperature (1.8 MPa, unannealed, 6.40 mm) | ASTM D648 | 95.0 | °C | |
| Heat‑Distortion Temperature (0.45 MPa, unannealed, 6.40 mm) | ASTM D648 | 104 | °C | |
| Vicat Softening Temperature | ASTM D1525 | 113 | °C | |
| Relative Temperature Index (RTI) | UL 746 | 85 | °C | |
| Electrical Properties | Volume Resistivity | ASTM D257 | 1E+17 | Ω·cm |
| Dielectric Strength (3.20 mm) | ASTM D149 | 19 | kV/mm | |
| Flame Retardancy | UL 94 Rating | UL 94 | V‑0 | — |
| UL 94 Rating (1.6 mm) | UL 94 | V‑0 | — |
Processing Parameters
| Process Parameter | Unit | Recommended Value / Range |
|---|---|---|
| Drying Treatment | ||
| Drying Temperature | °C | 100‑120 |
| Drying Time | h | 2‑4 |
| Recommended Moisture Content | % | < 0.04 |
| Injection Molding Temperature | ||
| Melt Temperature | °C | 230‑280 |
| Mold Temperature | °C | 50‑90 |
Note: All information above is for reference only!
